The RF MEMS acronym stands for radio frequency microelectromechanical system, and refers to components of which moving sub-millimeter-sized parts provide RF functionality. RF functionality can be implemented using a variety of RF technologies. Besides RF MEMS technology, ferrite, ferroelectric, GaAs, GaN, InP, RF CMOS, SiC, and SiGe technology are available to the RF designer. Each of the RF technologies offers a distinct trade-off between cost, frequency, gain, large scale integration, lifetime, linearity, noise figure, packaging, power consumption, power handling, reliability, repeatability, ruggedness, size, supply voltage, switching time and weight.
- Deposition of the bias lines (Fig. 2, step 3)
- Deposition of the electrode layer (Fig. 2, step 4)
- Deposition of the dielectric layer (Fig. 2, step 5)
- Deposition of the sacrificial spacer (Fig. 2, step 6)
- Deposition of seed layer and subsequent electroplating (Fig. 2, step 7)
- Beam definition, release and critical point drying (Fig. 2, step 8)