domingo, 25 de julio de 2010

Fraunhofer ISIT Selects Rudolph Technologies for MEMS Inspection

Rudolph advanced macro inspection system to be used for developing processes for high-volume manufacturing and packaging of inertial MEMS on wafer level.

FLANDERS, N.J., Jul 12, 2010 (BUSINESS WIRE) -- Rudolph Technologies, Inc. /quotes/comstock/15*!rtec/quotes/nls/rtec (RTEC 8.58, +0.46, +5.67%) , a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX(R) Series Macro Inspection System for advanced MEMS processing. The system will be installed this summer in the state-of-the-art 200 mm MEMS pilot production line at ISIT.

"We are pleased to continue working with ISIT on next-generation MEMS processes," said Hartmut Seeger, sales manager for Rudolph in Europe. "ISIT evaluated the NSX System along with several other inspection systems for this application. Acceptance of this tool confirms that the investments we have made to address unique MEMS inspection requirements, including the challenge of wafer handling, are meeting our customers' needs."

The ISO 9001:2008-certified production environment at ISIT enables the development of advanced MEMS devices for inertial, RF and electro-optical applications with the required application-specific packaging technology at the wafer level. The functional integration of extremely small features requires automatic defect inspection at small dimensions with high throughput and limited effect on the wafers. Hermetic wafer level vacuum packaging (with integrated getter) requires an inspection tool that is highly flexible in both hardware and software features.

"Silicon and glass cap wafers are not only fragile, but have deep cavities and sensitive features on both sides of the wafer, requiring a unique wafer handling concept," said Dr. Wolfgang Reinert, team leader-advanced electronic packaging, Fraunhofer ISIT. "The cap wafer inspection results need to be mirrored and interfaced with the ISIT final electrical test equipment for single device traceability and inkless assembly."

Sascha Muhlmann, MEMS engineer, Fraunhofer ISIT, added, "The capabilities of Rudolph's Discover(R) all-surface defect analysis and data management software on the NSX platform support these tasks during the device development phase and after the technology transfer to MEMS pilot production."

The NSX Series is a fast, repeatable macro defect inspection solution used throughout the semiconductor device manufacturing process. Macro defects can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX, specifically designed for back-end manufacturing and often selected by automotive device manufacturers for 100 percent inspection, can handle whole wafers and thinned wafers on film frames. It can quickly and accurately detect yield-inhibiting defects to provide quality assurance and valuable process information.

With this order from Fraunhofer ISIT, the installed base of Rudolph Technologies' NSX Systems totals over 600 worldwide.

The Fraunhofer Institute for Silicon Technology (ISIT) works on design, development and production of microelectronic components as well as micro-sensors, micro-actuators and other components for microsystems technology. Further services offered by the institute are analysis and development of technology pertaining to the quality and reliability of electronic assemblies as well as packaging and mounting technology for microsystems, sensors and multichip modules.

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. Rudolph offers yield management solutions used in wafer processing and final manufacturing through a family of systems for macro-defect inspection (detection and classification), as well as transparent and opaque thin film measurements.

The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary inspection and metrology solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at

Safe Harbor

This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act") which include demand for Rudolph's products, Rudolph's existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph's expectations about our future bookings and backlog as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company's ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending.

Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph's Form 10-K report for the year ended December 31, 2009 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph's current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

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Materia: CRF

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